Candor provides single, double side, and multilayer boards (up to 40 layers) depending on customer needs. For additional information on our multilayer capabilities please look at your capabilities section.
With todays digital signal processing using higher clock frequencies and shorter signal transition times PCB tracks need to be considered as transmission lines with regulated impedance. Impedance is controlled by the dimensions, materials, and configurations of the PCB.
Candor uses Polars CITS500s Controlled Impedance Test System, with this system Candor is able to determine the characteristic impedance of traces to ensure products meet customer standards. Candor can reach up to 2% tolerance of impedance controlled traces thanks to Panel Plating and Continuous Foil Lamination.
Candor uses a panel plating process that gives uniform plating across all boards which is needed for uniform signal propagation, keeping impedance tolarances withing required levels.
To get a smooth and consistent dielectric layer Candor uses continuous foil lamination with induction heating to maintain temperature across B-Stage pre-pregs. This results in a consistent dielectric layer thickness, allowing for uniform signal propagation with minimal track impedance variation.
Impedance Control should be considered when dealing with high speed/frequency digital and analog circuits. Designers specify these types of PCBs whenever the edge speeds of digital signals are faster than 1ns, or analog signals climb above 300MHz.
This is a technology that allows the manufacturer to assemble electronic components onto a flexible PCB substrate rather then the generic rigid PCB.
Flexible circuits are used where spacial constrainted limit the use of rigid circuit boards or designs require movable parts.
Up to 6 layers with and without stiffener.
Candor can make flex-regid printed circuit boards up to 6 layers
We can provide squenntional blind and burried vias depending on customer needs.
Candor can manufacture flexible boards with .5 mil cores!
With our simplified process we are able to manufacture sequential blind-buried vias with or without via filling.
With our landless via technology we can reduce spacing constraints. This gives our customers an design advantage compared to going to a conventional PCB manufacturer.
With our Panel Plating Technology heavy copper boards have superior even plating. We can put 6 oz of copper evenly in the hole as well! With our PPG liquid photo resist. deep trenches have no issues and close to perfect etching is achieved.
Metal backed copper boards have a base layer made of a metal substrate. This substrate is bonded to the circuit and dielectric layers of a board
This product is mainly used for high heat transfer designs such as:
We use aluminum oxide epoxy, this gives superior heat transfer than prepreg style which is used in a conventional process.
Thicker PCBs are useful when dealing with one or more of the following:
Candor is able to create PCBs with a maximum thickness of 0.380 inches. High spindle speed drilling machines allow for superior tolerance with very thick PCB's. We have done 0.380" thick PCB's with +/- 0.001" finished hole size and +/- 0.001" positional tolerance and continue to push the specs!
To get a smooth and consistent dielectric layer Candor uses continuous foil lamination with induction heating to achieve uniform heating. This gives a consistent dielectric layer thickness, allowing for uniform signal propagation.
Candor uses a panel plating process that gives uniform plating across all boards which is needed for uniform signal propagation, an important feature when dealing with radio and microwave frequencies.