Candor's Innovative Simplified Process

The Simplified Process was designed by Yogen Patel to offer the customer a seamless transition towards a superior product.

The design concept for this process must favour these objectives:

Design Objectives
Customer Product Benefit (Functional, Qualitative, Aesthetic)
Mechanical / Electrical Superiority and/or Stability
Operator Friendly (Simple, Repetitive, Basic Technical Skills)
Environmentally Friendly (Reduce, Re-use, Recycle)
Regulatory Compliance (Surpass Restrictions with Less Water)
Fewer Process Step (symptom of On-Time Delivery)
Process Control Advantage (less monitoring, ease of use)

The Difference Between the Simplified Process and Conventional Process

Candor's simplified manufacturing process has replaced many undesirable products and chemistries from fabrication processes found in the majority of PCB shops around the world. We can genuinely claim to be an environmentally friendly company since having completely eliminated the use of formaldehyde, EDTA, dry-film resists, ammonia based etch chemistry and tin-lead resists and their associated by-products.


Candor's Innovative Process Using Organic Liquid Photoresist

Candor Industries is the only PCB company in the world to have perfected a liquid photoresist process. Our primary imaging is a wet process and is not subject to adhesion failures and other defects associated with handling dry films, including foreign objects, resulting in greater line controls at etching.

Liquid Photoresist Technology Examples:
Fine Line Capabilities and Landless Via Technology

Photoresist Fineline Capability Photoresist Landless Via

How Liquid Photoresist Technology Exemplifies Candor's Simplified Manufacturing Process

Design Objectives
Customer Product Benefit (Functional, Qualitative, Aesthetic)
  • Thick, heavy copper boards can be manufactured with ease
  • Excellent impdence matching - up to 2% tolerance
  • Landless via capabilities
  • Fine line capabilities
  • Uniform copper distribution
  • No dry film handling related defects
Mechanical / Electrical Superiority and/or Stability
  • Even coating leading to great copper distribution
  • Uniform copper distribution
  • Fewer defects
Operator Friendly (Simple, Repetitive, Basic Technical Skills) Dry Film Related Processes removed, simplifying the process.
Environmentally Friendly (Reduce, Re-use, Recycle)
  • Liquid photoresist process removes dry film resist materials and ammonia based etch chemistry associated with it
  • Simplified pre clean
  • Less maintenance upstream and downstream
  • Less defects mean less need for inspection and repair
Regulatory Compliance (Surpass Restrictions with Less Water) The process uses minimal amounts of water.
Fewer Process Step (symptom of On-Time Delivery) Reduction of many process steps compared to conventional dry resist process.
Process Control Advantage (less monitoring, ease of use) With a reduced amount of process steps less variables need to be controlled therby reducing monitoring.

Graphite Metalization Compared to Conventional Process

By eliminating electroless copper, we achieve advancements for our customers and the environment. Graphite allows plated copper to interface directly with copper foils internally as well as on the surface. This superior adhesion is part of the reason our products survive some of the destructive tests we perform. In addition, by removing harmful EDTA's and formaldehydes from the process, our employees, as well as the environment benefit.

Candor's Graphite Metalization Process VS Electroless Copper

Plating Process



How The Graphite Metalization Process Exemplifies Candor's Simplified Manufacturing Process

Design Objectives
Customer Product Benefit (Functional, Qualitative, Aesthetic) Increased performance with destructive testing, therby giving a customer a better product.
Mechanical / Electrical Superiority and/or Stability Superior adhesion.
Operator Friendly (Simple, Repetitive, Basic Technical Skills) Reduction of complex baths that require constant observation and measurments.
Environmentally Friendly (Reduce, Re-use, Recycle) Removal of harmful EDTA's and formaldehyde allowing Candor to be an environmentally friendly facility.
Regulatory Compliance (Surpass Restrictions with Less Water) Extremely little water used compared to electroless copper.
Fewer Process Step (symptom of On-Time Delivery) Reduction in process steps give Candor the ability to do 1 day turns!
Process Control Advantage (less monitoring, ease of use) Less chemistry required with an increase in stability making the process easier to control.



Tensile Strength achieved with Candors Panel Plating

Panel Plating

How Panel Plating Exemplifies Candor's Simplified Manufacturing Process

Design Objectives
Customer Product Benefit (Functional, Qualitative, Aesthetic)
  • Practically perfect plating thickness both in hole and on the surface, with liquid photoresist the conventional issues wtih panel plating are solved. Customer impedance characteristics are easily achievable, unlocking 2% tolerances
  • Extremly accurate line widths and tolerances
Mechanical / Electrical Superiority and/or Stability Exceeds class 3A elongation, purity, and tensile strength.
Operator Friendly (Simple, Repetitive, Basic Technical Skills) Reduction in process calcuations therby increasing ease of use.
Environmentally Friendly (Reduce, Re-use, Recycle)
  • Recycle: Candor Recyles all excess copper
  • Reduce: With our easy to control, consistent process we reduce our scrap rate and reduce our material footprint
Regulatory Compliance (Surpass Restrictions with Less Water) Exceeds class 3A with very little water consumption.
Fewer Process Step (symptom of On-Time Delivery) Similar process steps with very little water consumption!
Process Control Advantage (less monitoring, ease of use) with even, uniform plating less monitoring is required.



Overview

To press multilayer printed circuit boards Candor uses a continuous foil lamination process rather than the converntional process. One continuous foil of copper is passed through each panel and is used as the heating substrate

Continuous Foil Lamination Place Holder 1 Continuous Foil Lamination Place Holder 2

Simplified Process: Why use Continuous Foil Lamination?

Design Objectives
Customer Product Benefit (Functional, Qualitative, Aesthetic)
  • Reduction of bow and twist
  • Significantly reduced Z-axis variation
Mechanical / Electrical Superiority and/or Stability
  • Panel to panel consistency
  • Structual deviation reduced
Operator Friendly (Simple, Repetitive, Basic Technical Skills) No heavy lifting required, heating and cooling systems are fast; reduced handling risks.
Environmentally Friendly (Reduce, Re-use, Recycle)
  • Reduction in heating and cure times, reducing power requirements
  • Reduce: With our easy to control, consistent process we reduce our scraprate and reduce our material footprint
Regulatory Compliance (Surpass Restrictions with Less Water) No water used!
Fewer Process Step (symptom of On-Time Delivery) The Process is computer controlled with reduction in manual process.
Process Control Advantage (less monitoring, ease of use) Reduction in temperature variation with superior controls for heat rise and cure.



An exciting new technology that allows Design Engineers to resolve space restrictions by eliminating via pad requirements is called Landless Via.

How does Candor Produce Landless Via

Traditional PCB manufacturing processes required an annular ring to facilitate proper plating in the hole and on the surface. Our plating methods allow us to eliminate this requirement, giving our customers a design advantage when dealing with HDI PCBs.

The Benefits of Landless Via Technology

  • Benefits blind and buried vias
  • Impedance requirements and regular through holes. Consistent impedance records for repeatability are second to none.
  • Greatly improves spacing issues with HDI and tight spacing requirement boards
Landless Via Continuous Foil Lamination Place Holder 2